Liquid cooling is proving effective at cooling high-power chips, such as GPUs, but it’s creating thermal issues for other nearby chips that previously benefited from the airflow ...

Moore’s Law has shifted toward advanced packaging over the past few years, but the limits of that approach are just now coming into focus. AI and HPC designs are growing larger ...

Based CPU-GPU Architecture with Replay-Driven Simulation and Emulation,” was published by researchers at Intel, Nvidia and ...

As ATE systems become increasingly complex and data-intensive, traditional rule-based optimization methods struggle to keep ...

A new technical paper, “Performance Analysis of Edge and In-Sensor AI Processors: A Comparative Review,” was published by University of Austria and ETH Zurich. Abstract “This review examines the ...

Inferencing at the edge has very different needs than training large language models or large-scale inferencing in AI data ...

An Experimental Methodology for Quickly Discovering the Reliable Read Disturbance Threshold of Real DRAM Chips,” was published by ETH Zurich and Rutgers University. Abstract “State-of-the-art DRAM ...

UALink data exchange and control; AI sovereignty; 3D-IC thermal behavior; UART security; SystemVerilog coverage extensibility.

A new technical paper, “Towards Structured Training and Validation of AI-based Systems with Digital Twin Scenarios,” was ...

A new technical paper, “Oxide induced degradation in MoS2 field-effect transistors,” was published by researchers at imec and ETH Zurich. Abstract excerpt “Transition Metal Dichalcogenides (TMDC) are ...

AI has been used in EDA for many years for the core algorithms in tools, but it’s getting smarter and more optimized with the rollout of generative and agentic AI. As it evolves and improves, hardware ...

Technology Co-Optimization of Bitline Routing and Bonding Pathways in Monolithic 3D DRAM Architectures,” was published by researchers at Georgia Tech. Abstract “3D DRAM has emerged as a promising ...