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Ultra-thin diamond wafers for electronics made using sticky tape
A new way to make ultra-thin diamond wafers using sticky tape could help produce diamond-based electronics, which might one day be a useful alternative to silicon-based designs. Diamond has ...
Hackaday4y
Your Own Open Source ASIC: SkyWater-PDK Plans First 130 Nm Wafer In 2020
Chip scale devices on a penny by Cp82 CC-BY-SA 3.0 In November, they plan to order a multiproject wafer with 40 slots. They don’t know yet if they will have to beg and plead to get 40 designs or ...
AZOM3y
Wafer Flipper from UHV Design
Let us help you with your inquiries, brochures and pricing requirements Request A Quote Download PDF Copy Request A Quote Download PDF Copy Request A Quote Download ...
AZOM13y
Semiconductor/Wafer Metrology Tools
Wafer metrology tools are used to design and manufacture ICs by carefully controlling the film properties, linewidths, and potential defect levels in order to optimize the manufacturing process of ...
Design-Reuse6y
New IC Manufacturing Lines to Boost Total Industry Wafer Capacity 8%
Wafer capacity growth of 8% forecast for 2018 and 2019 versus 4.8% average yearly growth from 2012-2017. February 12, 2018 -- IC industry wafer capacity, specifically in the memory segment, was ...
Design-Reuse4y
Synopsys and TSMC Accelerate 2.5D/3DIC Designs with Chip-on-Wafer-on-Substrate and Integrated Fan-Out Certified Design Flows
today announced that Synopsys and TSMC have collaborated to deliver certified design flows for advanced packaging solutions using the Synopsys 3DIC Compiler product for both silicon interposer based ...