The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore ...

Global memory leaders Samsung, SK Hynix, and ChangXin Memory Technologies (CXMT) are ramping up DRAM production this year, ...

Micron Technology initiated construction on (January 8, 2025) of a new High-Bandwidth Memory (HBM) advanced packaging ...

Micron Technology, Inc. (NASDAQ:MU) broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility near the ...

American tech giant Micron Technology has broken ground for what will be Singapore’s first plant producing advanced ...

Micron Technology is investing $7 billion to build an advanced chip packaging facility in Singapore as the semiconductor ...

Micron Technology revealed a plan to invest $7 billion for a new high-bandwidth memory (HBM) packaging plant in Singapore.

Micron Technology (MU) said it broke ground on a new High-Bandwidth Memory, or HBM, advanced packaging facility in Singapore.

Micron’s data center revenue surged 4X YoY and 40% sequentially in Q1-FY25, contributing 55% of consolidated revenue. High ...

Micron (MU) broke ground on a new high-bandwidth memory advanced packaging facility adjacent to the company’s current facilities in Singapore.