A chiplet supermarket is still years off, but progress is being made on all fronts.
Summary The UCIe standard, launched in 2022, streamlines die-to-die connectivity across multi-die systems, enabling interoperability between different process technologies. Synopsys' Manuel Mota ...
Naturally, chip manufacturers are turning to tools like simulation and generative AI to overcome these challenges. By doing so, they can evolve intricate processes that traditionally consume vast ...
For Wild Life Bakery we researched where they stored the packaging, how it fit in the space, how they served it from the counter, and that informed the design. Have you had any packaging disasters, ...
IC Validator, part of the Galaxy Implementation Platform, is the ideal add-on to IC Compiler for in-design physical verification, making it possible for place-and-route engineers to accelerate time to ...
Dr. JeFreda R. Brown is a financial consultant, Certified Financial Education Instructor, and researcher who has assisted thousands of clients over a more than two-decade career. She is the CEO of ...
WILSONVILLE, Ore., May 23 -- Mentor Graphics Corporation today announced the availability of Design Architect-IC(TM), a powerful and easy-to-use design capture tool. Design Architect-IC helps to ...
School of Chemistry, Guangzhou Key Laboratory of Materials for Energy Conversion and Storage, Key Laboratory of Electronic Chemicals for Integrated Circuit Packaging, South China Normal University ...
Benzinga and Yahoo Finance LLC may earn commission or revenue on some items through the links below. Taiwan Semiconductor Manufacturing Co’s (NYSE:TSM) plan to produce 2nm chips in Taiwan is ...
Another aspect in which physical stores beat online commerce is packaging. “Many products come in packaging, whether they were bought at a physical store or online. But the packaging, like the typical ...
Taiwan's Ministry of Economic Affairs (MOEA) will launch the second phase of its subsidy program for domestic IC design houses in 2025, aimed at boosting their competitiveness against global ...