The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

Today, Micron Technology has started constructing its multi-billion-dollar packaging facility for high-bandwidth memory (HBM) ...

Micron Technology (MU) said it broke ground on a new High-Bandwidth Memory, or HBM, advanced packaging facility in Singapore.

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MICRON Technology broke ground on its high-bandwidth memory (HBM) advanced packaging facility on Wednesday (Jan 8) in Singapore, adjacent to its existing facilities in Woodlands. Read more at The ...

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