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Ultra-thin diamond wafers for electronics made using sticky tape
A new way to make ultra-thin diamond wafers using sticky tape could help produce diamond-based electronics, which might one day be a useful alternative to silicon-based designs. Diamond has ...
AZOM3y
Wafer Flipper from UHV Design
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Design-Reuse6y
New IC Manufacturing Lines to Boost Total Industry Wafer Capacity 8%
Wafer capacity growth of 8% forecast for 2018 and 2019 versus 4.8% average yearly growth from 2012-2017. February 12, 2018 -- IC industry wafer capacity, specifically in the memory segment, was ...
Design-Reuse4y
Synopsys and TSMC Accelerate 2.5D/3DIC Designs with Chip-on-Wafer-on-Substrate and Integrated Fan-Out Certified Design Flows
MOUNTAIN VIEW, Calif., Aug. 25, 2020 -- Synopsys, Inc. (Nasdaq: SNPS) today announced that Synopsys and TSMC have collaborated to deliver certified design flows for advanced packaging solutions using ...