TSV technology allows for high-density stacking and direct vertical connections, making it a foundational technology for next-generation chips.

Susquehanna lowered the firm’s price target on Teradyne (TER) to $145 from $165 and keeps a Positive rating on the shares. The firm updated its ...

Beyond TSV, GVT is also developing front-end solutions in areas such as atomic layer deposition, metrology, and inspection ...

Due to the age of some plants, and intensity of earthquake, several Tainan fabs reported equipment shutdowns, with the extent ...

It was awarded by a global leader in wafer fabrication equipment and services. Grand Venture Technology Limited (GVT) has ...

Global market intelligence firm IDC, in its most recent report, projected a 15% growth for the global semiconductor market in ...

Global semiconductor revenue is expected to slow to mid-single digits in 2025, which marks a steep fall from the 20% growth seen in 2024, according to a forecast by Susquehanna. Global wafer fab ...

Titan Engineering & Automation Ltd, a subsidiary of Titan Company Ltd, plans to expand in Chennai and Hosur, focusing on ...

The firm had updated its outlook for the semiconductor industry which revealed that spending on wafer fab equipment, which is used to make computer chips, is expected to be around $94 billion in ...

Accelerate tool development and reduce the consumption of physical resources like silicon wafers, chemicals, and gases.