Dice being singulated with a diamond saw The general plan is to use testing at a variety of points to improve overall quality, by weeding out bad wafers (PCM data) bad die (wafer probe ...

The brief was that the wafer probe yield was disastrous and the correlation wafer was not giving the correct results. Getting to the punch line is going to require some IC fabrication background ...

One significant advancement in on-wafer probing is the development of a new waveguide ground-signal-ground (GSG) probe designed for millimeter-wave measurements. This probe integrates a GSG tip ...