The U.S. government launched the $280 billion CHIPS for America Act in 2022 to address these challenges. Beyond the CHIPS Act ...

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High density and complex connectivity introduce new challenges for packaging design and assembly manufacturing validation.

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Speaking on the sidelines of an event hosted by chip supplier Siliconware Precision Industries in Taichung, Taiwan, Huang explained the transition in Nvidia's chip packaging requirements.

The Information (paywall, via Reuters) claims that overheating and other related "glitches" have caused customers to delay Blackwell orders or switch to Nvidia's earlier and presumably less ...

Imec, a research and innovation hub in nanoelectronics and digital technologies, has announced a significant milestone in silicon photonics with the successful demonstration of electrically driven ...

Advanced packages with 2.5D and 3D integration schemes are projected to grow at a rate of 19% from 2024 through 2028, according to TechInsights. Interconnect bump heights in high volume manufacturing ...

Rising complexity and heterogeneous integration are reshaping test methodologies and fault coverage, but challenges persist.

Bernardette Kunert, scientific director at imec, commented, “Over the past years, imec has pioneered nano-ridge engineering, a technique that builds on SAG and ART to grow low-defectivity III-V ...