From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...

Intel's foundry business never seems far from the headlines these days, not least because various ex-executives continue to publicly debate whether it might be a good idea to split it from the rest of ...

EV Group unveils new version of its GEMINI automated production wafer bonding system supporting MEMs advancements.

The Global Semiconductor Wafer market is projected to grow significantly, from 24,362.2 million in 2025 to 42,987.0 million ...

At the heart of this revolution is the 220nm device layer SOI wafer — a critical substrate that facilitates the fabrication of compact, high-performance photonic components. Why 220nm SOI Wafers ...

ACM Research, Inc. announced that its Single-Wafer High-Temperature Sulfuric Peroxide Mixture (SPM) tool has been qualified by a major logic device manufacturer in mainland China. This system ...

EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the next-generation ...

These specialized wafers have become the cornerstone of integrated photonic circuits, enabling the development of advanced optical communication systems, data transmission solutions, and ...