A chiplet supermarket is still years off, but progress is being made on all fronts.

Delamination occurs when there is a mismatch in coefficients of thermal expansion (CTE) between the encapsulate materials, such as the mold compound used to encapsulate the semiconductor chip and the ...

VLSI Society of India organized popular annual event "International VLSI Design ... Cyber Physical Systems & Automotive Systems', 'Test, Verification & Reliability', 'Quantum Computing & Neuromorphic ...

The exploration of AI and ML algorithms in VLSI design further underscores the potential for these technologies to streamline design processes, reduce turnaround times, and improve overall IC ...

However, the benefits of DDR2 SDRAM are coupled with significant physical implementation challenges at data ... To further compound the problem, memory interface designers who use third-party ...

Founded in 2015 by Uday Joshi and Sandip Kadtane, Cientra is a semiconductor solutions company, specialising in VLSI ... level (RTL) design, design verification, physical design, and analogue ...

The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...

1 Introduction For Semiconductor ... Synopsys IP packaging tool (coreBuilder), or which have a SPIRIT component representation. After a user has assembled and configured their subsystem, he chooses an ...

GENIO EVO, an integrated chiplet/package EDA tool, addresses thermal and mechanical stress in the pre-layout stage of 3D IC ...

Group company specializing in consumer logic IC packaging and testing, has reported better-than-expected... Save my User ID and Password Some subscribers prefer to save their log-in information so ...