Yield dropout due to given below defects. 1. Random Defects: Due to form of impurities in the silicon itself, or the introduction of a dust particle that lands on the wafer during processing. These ...

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Siddhartha Sinha, principal member of technical staff, explains how imec has achieved seamless InP Chiplet integration on 300mm RF Silicon Interposer with excellent performance at 140GHz. Using RF ...