The use of tiny wires that are soldered to the bare chip (bare die) on one end and to metal leads of the chip package on the other. Before the advent of flip chips and solder ball techniques, wire ...
Smiths Interconnect has introduced 50GHz 0404 wire-bondable chip attenuators. HR TSX Wire Bond 2 series are space-qualified to MIL-PRF-55342 and available in 1 to 10dB versions as well as 15dB and ...
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