Chip scale devices on a penny by Cp82 CC-BY-SA 3.0 In November, they plan to order a multiproject wafer with 40 slots. They don’t know yet if they will have to beg and plead to get 40 designs or ...
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Ultra-thin diamond wafers for electronics made using sticky tapeA new way to make ultra-thin diamond wafers using sticky tape could help produce diamond-based electronics, which might one day be a useful alternative to silicon-based designs. Diamond has ...
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TSMC Announces New System-on-Wafer Process With 3D-StackingThis week, TSMC held a technology conference in the heart of Silicon Valley to showcase some of its upcoming technology. We have already covered its upcoming A16 manufacturing node. The company ...
Wafer capacity growth of 8% forecast for 2018 and 2019 versus 4.8% average yearly growth from 2012-2017. February 12, 2018 -- IC industry wafer capacity, specifically in the memory segment, was ...
today announced that Synopsys and TSMC have collaborated to deliver certified design flows for advanced packaging solutions using the Synopsys 3DIC Compiler product for both silicon interposer based ...
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