Luton, Bedfordshire, United Kingdom, Dec. 03, 2024 (GLOBE NEWSWIRE) -- Wafer marking equipment plays a crucial role in semiconductor manufacturing, enabling the application of identification marks, ...

Now, joined by its recently acquired subsidiary, Control Micro Systems, Inc. (CMS), LPC has expanded its product line of advanced laser wafer dicing, marking, and scribing technologies.

Laser technology for wafer serialization entails the marking, scribing, and lapping of wafers composed of silicon and related compounds. LPC will continue to advance Control Micro Systems multi ...