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The impact of embedded micro-bumps and wafer-to-wafer hybrid bonding on the thermal behavior of the package stack.
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Rambus announces HBM4 memory controller for AI GPUs — controller enables up to of 2.56 TB/s per HBM4 memory stack across a 2048-bit memory busThis enables a memory bandwidth of 2.56 TB/s per HBM4 memory stack with a 2048-bit memory interface. The Rambus HBM4 controller IP can be paired with third-party or customer-provided PHY solutions ...
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