Convergence of 2.5D and 3D packaging using HBM3, GLink-2.5D/UCIe and GLink-3D interfaces enables highly modular, chiplet-based, much bigger than reticle size processors of the future,” said Igor ...
Hsinchu, Taiwan – September 6, 2023 – Global Unichip Corp. (GUC), the advanced ASIC leader, announced that they have silicon proved 8.4 Gbps HBM3 solution on TSMC’s 5nm process technology. The ...
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