TSMC is also optimizing its packaging technologies, particularly CoWoS-L and CoWoS-R, to support HBM4 integration. These advanced packaging methods enable the building of interposers of up to ...

Supply chain sources indicate that TSMC's CoWoS capacity target for 2025 has been slightly adjusted downward, however, it is expected to rise consistently with the addition of new capacity in the ...

When Amkor announced plans to build a $1.6 billion chip test and packaging facility near Peoria, Arizona, it was clear that the company planned to serve TSMC’s customers in the state. Apple is ...

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful launch of the industry's first Universal ...

What Happened: Market chatter suggested that Nvidia's CoWoS wafer orders at TSMC had been cut from over 400,000 wafers to 380,000 wafers, fueling concerns about AI demand fluctuations. However ...

TSMC (TSM.US)’s CoWoS is rumored to have faced order cuts and slackened production expansion, according to multiple media reports. TSMC Chairman CC Wei clarified that it is a... In fact, the ...

Hsinchu, Taiwan – June 8, 2021 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out AI/HPC/Networking CoWoS® Platform with 7.2 Gbps HBM3 ...