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Broadcom unveils gigantic 3.5D XDSiP platform for AI XPUs — 6000mm² of stacked silicon with 12 HBM modules
The new platform relies on TSMC's CoWoS and ... of approximately 5.5 times that of a reticle (about 858 mm^2), or 4719 mm^2 for compute chiplets, I/O chiplets, and up to 12 HBM3/HBM4 packages.
Design-Reuse1y
GUC Announced 5nm HBM3 PHY and Controller Silicon Proven at 8.4 Gbps
It contains full functional HBM3 Controller and PHY IP and vendor’s HBM3 memory using TSMC’s industry leading CoWoS® technology. HBM memory vendors keep aggressive roadmap increasing throughput and ...
Design-Reuse3y
GUC Tapes Out AI/HPC/Networking Platform on TSMC CoWoS Technology Validating 7.2 Gbps HBM3 Controller and PHY, GLink-2.5D and 112G-LR SerDes IPs
Hsinchu, Taiwan – June 8, 2021 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out AI/HPC/Networking CoWoS® Platform with 7.2 Gbps HBM3 ...