This shift comes as HBM and chip-on-wafer-on-substrate (CoWoS) technology growth has begun to slow amid issues related to overheating, power consumption, and cost challenges taking hold.

HBM-based chip designs are being categorized as AI-related and subject to tighter controls. Over the last few months, there has been a sustained decline in CoWoS advanced packaging orders from ...

It allows shorter routing, better signal integrity, higher speed and lower power consumption than traditional zig-zag HBM bus routing ... GUC’s design for CoWoS and interposer supports 112G-LR SerDes ...

It contains full functional HBM3 Controller and PHY IP and vendor’s HBM3 memory using TSMC’s industry leading CoWoS® technology. HBM memory vendors keep aggressive roadmap increasing throughput and ...

TSMC is a key partner of the triangular alliance between NVIDIA + SK hynix + TSMC, with the company expected to expand its CoWoS advanced packaging capacity in 2026 to handle the large Rubin chip ...

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful launch of the industry's first Universal ...

According to estimates by SemiAnalysis, Nvidia’s B200, which will feature 192 GB of high-bandwidth memory (HBM), will begin shipping ... technology called CoWoS-L from Taiwanese foundry giant ...