Supply chain sources indicate that TSMC's CoWoS capacity target for 2025 has been slightly adjusted downward, however, it is expected to rise consistently with the addition of new capacity in the ...

“AI remains robust as expected, despite plenty of cross-currents, while CoWoS capacity is expected to double in 2025,” he said. The analyst noted that server supply-chain feedback suggested a ...

Currently, all of TSM's CoWoS capacity is in Taiwan. The talks are at an early stage, and no decisions on the scale or the timeline for a potential investment have been made, the report noted.

More than 70% of TSMC’s CoWoS-L advanced packaging capacity has already been booked, fueled by strong demand for Nvidia’s Blackwell GPUs. This surge is also driving orders to major backend ...

However, on Monday, Kuo said that these rumors were likely based on misinterpretations of Nvidia's production strategy and exaggerated expectations of TSMC's capacity. "Nvidia's CoWoS orders at ...

The platform supports both the TSMC CoWoS-S (silicon Interposer) and the CoWoS-R (organic interposer) advanced packaging technologies. The platform represents real-world CPU/GPU/AI/Networking chips by ...

Hsinchu, Taiwan – June 8, 2021 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out AI/HPC/Networking CoWoS® Platform with 7.2 Gbps HBM3 ...