Semiconductor packaging plays a crucial role in modern electronics by protecting the chip, enabling electrical connections, ...

announced today that their jointly developed 2.5D packaging platform has successfully entered the mass production stage. The one-stop advanced packaging platform and service developed through ...

OSATs and ATE vendors are making progress in determining what works and what doesn’t in 2.5D packaging, expanding their knowledge base as this evolves into a mainstream technology. Most experts ...

As more designs hit the reticle limit, or suffer from decreasing yield, migrating to 2.5D designs may provide a path forward. But this kind of advanced packaging also comes with some additional ...

“eSilicon adds to Inphi world-class 2.5D packaging, SerDes, custom silicon and operations teams. Just as we successfully leveraged our Cortina and Clariphy acquisitions, eSilicon will advance our ...

Harlan Sur, JPMorgan, queried about advanced packaging growth. CEO Wallace noted that 2.5D packaging and high-bandwidth memory are primary drivers, with advanced packaging revenue projected to ...

More specifically, it combines 2.5D packaging with a wider interface at a lower clock speed (as compared to DDR4) to deliver higher overall throughput at a higher bandwidth-per-watt efficiency for ...

IDTechEx have been closely monitoring the advancements in 2.5D and 3D advanced semiconductor packaging. Their reports, titled "Advanced Semiconductor Packaging 2023-2033" and "Materials and Processing ...